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| ILX547K 2700 x 3 pixel CCD Linear Sensor (Color) For the availability of this product, please contact the sales office. Description The ILX547K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 300DPI. The distance between lines is only 4 line (32m). The power supply of this device is single 5V. Features * Number of effective pixels: 8100 pixels (2700 pixels x 3) * Pixel size: 8m x 8m (8m pitch) * Distance between line: 32m (4 lines) Block Diagram * Maximum data rate: 6MHz (2MHz x 3) * Built-in clamp circuit * Low lag/High sensitivity * Single 5V power supply * Input clock pulse: CMOS 5V drive * Number of output: 3 (R, G, B) * Package: 22 pin Plastic DIP (400mil) CCD analog shift register (G) CCD analog shift register (R) CCD analog shift register (B) 22 pin DIP (Plastic) Reset out gate (G) Reset out gate (R) Pin Configuration (Top View) VREF VOUT (G) GND NC NC NC NC NC NC NC ROG 1 1 1 1 2 3 4 5 6 G R B 7 8 9 10 2700 2700 2700 11 22 VOUT (R) 21 VOUT (B) 20 VDD Timing generator , Amplifier (G) Amplifier (R) Amplifier (B) CLP VOUT (B) 21 Reset out gate (B) Sensor (G) Sensor (R) Sensor (B) Absolute Maximum Ratings * Supply voltage VDD 6 * Operating temperature -10 to +60 * Storage temperature -30 to +80 V C C ROG driver 11 ROG 13 12 3 19 20 1 1 19 RS 18 NC 17 NC 16 NC 15 NC 14 NC 13 1 12 2 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- VOUT (G) 2 VOUT (R) 22 E99908-PS VREF VDD RS GND 2 ILX547K Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol VREF VOUT (G) GND NC NC NC NC NC NC NC ROG Description Reference voltage Signal output (G) GND NC NC NC NC NC NC NC Clock pulse input Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol 2 1 NC NC NC NC NC RS VDD VOUT (B) VOUT (R) Description Clock pulse input Clock pulse input NC NC NC NC NC Clock pulse input Power supply Signal output (B) Signal output (R) Recommended Supply Voltage Item VDD Min. 4.75 Typ. 5 Max. 5.25 Unit V Input Pin Capacity Item Input capacity of 1, 2 Input capacity of RS Input capacity of ROG Symbol C1, C2 CRS CROG Min. -- -- -- Typ. 900 60 10 Max. -- -- -- Unit pF pF pF Clock Frequency Item Frequency of 1, 2, RS Symbol f1, f2, fRS Min. -- Typ. 1 Max. 2 Unit MHz Input Clock Pulse Voltage Item 1, 2, RS, ROG pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V -2- ILX547K Electrooptical Characteristics (Note 1) (Ta = 25C, VDD = 5V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Red Sensitivity Green Blue Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Green Blue Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE Zo VOS Min. 3.6 4.4 3.1 -- 1.2 0.16 0.13 0.19 -- -- -- -- 92 -- -- Typ. 5.6 6.8 4.8 4 1.5 0.27 0.22 0.31 0.5 3 1 9.5 98 430 3.6 Max. 7.6 9.2 6.5 20 -- -- -- -- 3 10 -- 15 -- -- -- mV mV % mA % V Note 6 Note 6 Note 7 -- -- -- Note 8 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks Notes) 1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of the signal level of the optical black pixels. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT (G) = 500mV (Typ.) PRNU = (VMAX - VMIN)/2 VAVE x 100 [%] Where the 2700 pixels are divided to blocks of 150, R, G and B pixels, respectively. The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R , VOS GND Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6. Optical signal accumulated time int stands at 10ms. 7. VOUT (G) = 500mV (Typ.) VOUT 8. Vos is defined as indicated bellow. VOUT indicates VOUT (R), VOUT (G) and VOUT (B). -3- Clock Timing Chart 1 ROG 5 0 3 2 2764 D63 D64 1 5 0 2 5 0 RS D2700 S2699 5 D1 D2 D3 D12 D13 D14 D60 D61 D62 S1 S2 VOUT Optical black (48 pixels) Dummy signal (62 pixels) Effective picture elements signal (2700 pixels) 1-line output period (2764 pixels) , S2698 -4- 0 Note) The transfer pulses (1, 2) must have more than 2764 cycles. 1 ILX547K ILX547K Clock Timing Chart 2 t4 t5 ROG t6 t2 t7 1 t1 t3 2 Clock Timing Chart 3 t7 t6 1 2 t10 t9 RS t8 t11 VOUT , , t12 t13 -5- ILX547K Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS, 1 pulse timing RS pulse rise time RS pulse fall time Signal output delay time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 Min. 50 800 800 0 0 0 0 50 80 0 0 -- -- Typ. 100 1000 1000 5 5 10 10 2501 2501 10 10 130 40 Max. -- -- -- 10 10 60 60 -- -- 30 30 -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns 1 These timing is the recommended condition under fRS = 1MHz. -6- Application Circuit RS VOUT (B) IC1 1 2 VOUT (R) Buffer1 2 2 2 Buffer1 22 NC NC NC NC VDD VOUT (R) VOUT (B) RS NC 21 20 19 18 17 16 15 14 13 1 12 2 NC VREF VOUT (G) GND NC NC NC NC NC NC 1 3 Buffer1 Buffer1: 100 VOUT (G) 2 4 5 6 7 8 9 10 100 5V IN 10F/16V 5V 0.1F 47F/16V ROG 11 IC1 ROG IC1: 74AC04 -7- 2SK523 OUT 1.5k Data rate fRS = 1MHz ILX547K Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ILX547K Example of Representative Characteristics (VDD = 5V, Ta = 25C) Spectral sensitivity characteristics (Standard characteristics) 1.0 0.8 Relative sensitivity 0.6 0.4 0.2 0 400 450 500 550 Wavelength [nm] 600 650 700 Dark voltage rate vs. Ambient temperature (Standard characteristics) 100 10 Output voltage rate vs. Integration time (Standard characteristics) 10 Output voltage rate 0 10 20 30 40 50 60 Dark voltage rate 1 1 0.1 -10 0.1 1 5 int - Integration time [ms] 10 Ta - Ambient temperature [C] Offset level vs. Supply voltage (Standard characteristics) 5 5 Offset level vs. Ambient temperature (Standard characteristics) 4 Vos - Offset level [V] Vos - Offset level [V] 4 3 Vos VDD 2 0.8 3 2 Vos Ta 1 -1mV/C 1 0 4.75 5 VDD - Supply voltage [V] 5.25 0 -10 0 10 20 30 40 50 60 Ta - Ambient temperature [C] -8- ILX547K Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass 0.9Nm , , Plastic portion 39N 29N 29N Ceramic portion Adhesive (1) (2) (3) (4) , , , , , , , , , , , , b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. -9- ILX547K 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 10 - Package Outline Unit: mm 22pin DIP(400mil) 32.0 0.3 22 12 5.0 0.3 H 11 0.25 1 30.6 10.0 0.3 No.1 Pixel (Green) 1. The height from the bottom to the sensor surface is 1.61 0.3mm. 4.0 0.5 2.10 2.54 0.3 M 0.51 PACKAGE STRUCTURE PACKAGE MATERIAL Plastic , Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE MASS 2.21g ILX547K DRAWING NUMBER LS-D8-01(E) 2.80 0.5 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. 10.16 V 9.0 0 to 9 6.8 0.3 21.6 (8m X 2700Pixels) - 11 - |
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